ADC12DJ3200: Recommended pressure

Dear Technical Support Team,

Could you inform me of the recommended vertical pressure to the package(FCBGA)?

I concerned that the vertical pressure of the heat sink may damage ADC package.

The FCBGA(10mm x 10mm ) is much smaller than traditional packages,

so I guess that  the vertical pressure to fix the heat sink will concentrate and increase to the package.

According to the following E2E, it said that  IC is evaluated up to 100 [N]

Suggested an answer to: DAC5670-SP: Recommended pressure to apply so that the solder balls will not be damaged?

TI Thinks Resolved

Hi, This is the only data our packaging team has on this. "I found a FCBGA, Designator GTS, 23 X 23, 288 balls, 1.0mm pitch. Test stopped at 100N without failure." I recommend you either purchase…

By Christian Yots over 7 years ago in Space & High Reliability (Read Only) > Space & High Reliability Forum (Read Only)

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This is the only data our packaging team has on this.

"I found a FCBGA, Designator GTS, 23 X 23, 288 balls, 1.0mm pitch. Test stopped at 100N without failure."

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Best Reagrds,

ttd