ADS1282-SP: Vacuum condition

Hi ttd,

Yes, the ADS1282-SP will work in a vacuum pressure environment.

Unfortunately, I have not ever seen any data that has looked at IC performance vs air pressure. Typically, temperature, radiation, and moisture are the biggest culprits that can affect performance and reliability. We protect against moisture by encapsulating the device with a mold compound and hermetically sealing the assembly inside a ceramic package. This process helps provide mechanical stability and protection from the outside environment, so this should also provide some immunity to changes in the outside pressure. For more information on packaging technology, refer to https://www.ti.com/lit/an/snoa286/snoa286.pdf.

That being said, if there were some sensitivity to outside air pressure, I imagine it would likely take on the form of an offset drift or gain error drift over large changes in pressure. For example, I know that with some bandgap references if you physically compress the IC package you can sometimes see the reference voltage change. As with any offset or gain error you can always perform a calibration to remove the initial offset and gain error introduced at a given condition, or calibrate the system under multiple operating conditions to help compensate for the effects of offset and gain error drift.   

I hope that helps. If you have any additional information or experience with ICs that have behaved differently under pressurized conditions I would be eager to learn about it!