I’d very much appreciate a design review before I send a datalogger board I’ve laid out for manufacturing. I’ve marked areas where I’m uncertain of my design decisions.
The board that employs two ADS1262 chips. It’s a Raspberry PI daughter board that serves as a slave on two separate SPI buses. It will acquire data at 100SPS on four differential inputs at 100SPS, two on each channel. The board also incorporates a 256KB EEPROM. I’m running the SPI buses entirely through commands, so I haven’t connected RESET, PWDN, etc.
The board draws 3.3 and 5V power from the Pi, so I haven’t worried much about fuses, etc. I’ve checked the 5V and 3.3V power from the PI, and there’s about 7m rms noise on both, mostly 60Hz. AINCOM, 5V, 3.3 BYPASS, REFOUT are connected through a 1uF capacitor to ground. AVDD = 5V, DVDD = 3.3V, AVSS = DGND = GND.
It’s a 4-layer board: Component – Ground (single ground plane, no traces) – Power (both 3.3V and 5V) – Signal for traces that I couldn’t connect without vias on the Component plane.
I Imitated the ADS1262X-EVM for layout and for analog input filters and, tried to follow advice in ADS1262 datasheet on layout. Because the data rate for my board is only 100 SPS, I’ve swapped the 47nF capacitors on the EVM’s input filters for 10uF, giving a calculated cutoff frequency of 338Hz. Please comment on this.
The two ADS1262 chips are separated physically, each the only device on separate SPI buses, so CS is tied to GND for both chips. All unused inputs on the two ADC’s are also tied to ground. I’ve used one layer for both analog and digital components but have separated them, analog at the bottom, digital on top.
I have separated the differential inputs but have not worried too much about exactly matching trace length because of the slow sample rate. Please comment on this.
I’m using the chips’ internal clocks and reference voltages. Because of the slow sample rate, I intend to run the clock at 250KHz or so. All digital SPI signals (SCLK, MISO, MOSI, DRDY) include 47ohm resistor to minimize ringing. SCLK, MISO, and MOSI don’t pass through vias. DRDY does but same info is largely redundant as same info is contained in MISO. AINCOM passes through a via. One pair of CAPP signals passes through vias, other is direct.
Both chips' CAPP and CAPN signals are connected by a 47nF capacitor and brought out to a connector.
I used 0.400 mm traces throughout for signals, 1mm for power and GND wherever possible. Please comment on this.
All four copper planes are tied to ground, but I have dropped multiple vias to the ground plane from the Component plane wherever possible, several vias to the Power plane around connections, stitching through-board vias in multiple places to reduce inductance. Please comment on this.
The two ADS1262 chips require 3.3 V and 5V, and the EEPROM requires 3.3V. Power is dropped from Component plane to Power plane through two vias, then run to vias up to the Component plane. Please comment on this.
I'm happy for our conversation to be public but not schematics, photos, gerbers, etc. I develop in Kicad. What files would you like?
Thanks for your help.