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Power handling

Other Parts Discussed in Thread: DLP9500, DLP6500FLQ, DLP7000, DLP9000

Hi,


I know there are many questions relating to power handling on the forum but I would like some clarification about some of the advice given, if possible.  The datasheets for the majority of the DLP chips state a maximum power density that is related to wavelength.  In the visible, this is generally noted as being limited by heating effects.  However, I have also seen references to 25 W/cm2 as being the max. power density that DMD's can handle (in the laser power handling application note).  I am trying to assess whether the DLP chips (any of them) will be suitable for an application with a CW source of 25 W (400 - 1400 nm), if this is spread over the surface of one of the larger chips, and 25 W/cm2 is an acceptable power density, then this is fine.  Just hoped for some clarification as there is a bit of ambiguity regarding maximum powers.

Thanks very much in advance.

  • We received your query, please allow sometime for the response.
  • Hello AM,

    We have updated the specs a little because the underlying issues are thermal for the most part, unless you are using very high pulse energies with a pulsed laser.

    The Type A DMD's (DLP6500FLQ, DLP7000, DLP9000, & DLP9500) should work with this power density, but you must employ a good heat solution.  This is part of the reason that we updated the spec, because some were looking at the power density spec without paying attention to the need for a sufficient thermal solution.

    There is one other note.  technically past 700 nm (700 - 1400 nm) you will be out of the datasheet spec. 

    Also the mirrors are aluminum so that they follow closely the absorbance of bulk aluminum.  This means that around 830 nm there is a dip in the reflectivity to about 75%. If you operate in this dip you will absorb much more power and will have to adjust accordingly.

    Best regards,

    Fizix