Hi,
I know there are many questions relating to power handling on the forum but I would like some clarification about some of the advice given, if possible. The datasheets for the majority of the DLP chips state a maximum power density that is related to wavelength. In the visible, this is generally noted as being limited by heating effects. However, I have also seen references to 25 W/cm2 as being the max. power density that DMD's can handle (in the laser power handling application note). I am trying to assess whether the DLP chips (any of them) will be suitable for an application with a CW source of 25 W (400 - 1400 nm), if this is spread over the surface of one of the larger chips, and 25 W/cm2 is an acceptable power density, then this is fine. Just hoped for some clarification as there is a bit of ambiguity regarding maximum powers.
Thanks very much in advance.