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About DLP6500-c900 reference design

Myoungkag Kim
Prodigy 10 points

I'd like to make PCB following to reference design DLP6500-C900 and there is a process  note 2. 

"Plate indicated areas (top side) with electroplated gold (35 - 50 micro inches) over electroplated nickel ( minimum 100 micro inches )."

Is it ok to do ENIG(Electroless nickel immersion gold) instead? as I know there is thickness difference about 2 times.

 

  • 0
    TI__Mastermind 30600 points
    Myoungkag,

    Welcome to the DLP Forums and thank you for your question!

    On that particular process note, the area that is called out is the connector for the flex cable between the two boards of the EVM. Signal integrity is quite important at this connector and electroplated gold minimizes the risk of signal integrity issues at the connector. ENIG can cause signal loss for high speed signals, which this flex carries.

    It is up to you to assess the risk of using ENIG on that particular connector - if your fabricator and engineering team are comfortable with making that change, then go ahead. On the EVMs that TI sells, we follow this schematic and the recommendation that we give regarding electroplated gold.

    Thanks,
    Paul