Hi Support Team
I have a customer asking me the following questions on the DLP3010
1) Is the DLP to be direct reflow soldered? There is no socket? I was not aware the DLP could stand up to reflow temperature. Is there a recommended reflow profile?
2) Re Figure 24 on page 31 . Can you give me more details about the stackup in the layout example. How many layers? I take it the ground plane is transparent in the picture. Is via-in-pad used? Could you hook me up with your flex cable expert.
Thanks
Jeff Coletti