I'm currently using the dlps038c.pdf (attached) and I don't see an explicit land pattern for this package in the documentation. On page 60 there is a drawing that shows the layout of the PBGA, but there are no details about what land or stencil pattern use when designing a PCB for this chipset.
Hi Navneet,
> You can try by looking at the TI Refernce Design EVM here :
The reference design you have cited doesn't use the DLPC3430, it uses the DLPC3435. That reference design has been of great help to me while I was doing the schematic, but since I'm using a different part, with a different package, the included gerber files don't help me with the PCB land pattern for the DLPC3430.
> You can find latest Datasheet to check the Land Pattern Example here
I've included a screen shot of the the only drawing for the S-PBGA_N176 ball pattern from the datasheet.
It includes the ball spacing, but there is no information about the pads on the PCB to which the part will mate. All of the other drawings in the document are for the ZEZ0201A pattern. I'm wondering if there is any other documentation about the layout of those pads or any documentation on how to break out the pins on this package.
Thanks,
Stephen Craig
