DLPC350: DLPC350ZFF reflowr profile and Msl leve

Hello user,

Welcome to the E2E forums, and thanks for your interest in our DLP technology.

Allow me to ask for further clarification. For your design, you have constructed 4 PCBs, 2 of which encountered failures. In these failures, you have found that the power supply and ground are shorted. Is this correct?

We will take a look to see if we can find any information about soldering the DLPC350 for you. In the meantime, have you compared your PCB layout against the reference design to ensure that it is not a layout issue?
www.ti.com/.../dlp4500-c350ref

Best Regards,
Philippe Dollo

Hello Philippe

thank you for your reply. Yes   your clarifiction is correct. when in funtion test  the 2PCS PCBA  are not work,we use the multimeter to check and found the 3.3 power supply is shorted to ground in pcba, so we  remove the component DLPC350 from PCBA,the short is disappear. also we use the multimeter to test the VDD33 and VSS pin of the  component DLPC350 , we found the two pin are short  and I think the two  components is damaged.

In my opinion  for the damaged .I think  power breakdown short circuit  and wafer shirt or beark are the most likely  reason.  Power breakdown is caused by EOS it   maybe circuit and pcb layout problem or ESD and abnormal function test.   Wafer shirt or beark is caused by solder peak tempreture and moisture.In my past analysis of failures, I found TI'S LM217，LMZ142，TMS320，DM3070 series componets all have short circuits between power supply and ground pins after  through reflow solder without PCBA function test In sample and small scale production. as  I know these componet MSL leveL  is 3. it's floor life is 168hours Under 30 degrees and 60 % RH. But in some  cases these sample componet is not sealed in transport and stroage. so before refllow it need to be bake I check the DLPC350 datashset, its length and width is 23mm ,its thickenss is 2.35mm  based on IPC/J-STD-033C and J-STD-020D.1 standard,the DLPC350 need to take48 hours to bake at  125 degrees.and reflow peak tempreture must blow 250 degrees. but  I don.t konw the reflow time  for Tp and TL  at this link  http://www.ti.com/lit/an/spraby1/spraby1.pdf  ,maybe the DLPC350 TI has its own special reflow profile like the LM217 series. I hope you can provide theDLPC350‘s reflow profile and curve to me  if you have ,I can't find it in TI official website.

Based on your link I had dowload the file  DLP4500-C350REF.brd,and let our PCB layout engineer  to compare and Can you tell me what the main points of comparison in pcb layout  about this component damaged problem ?