Hi Netra Champs,
We need to support on
1) Thermal Model (Impedance network) for simulation – starting from junction to package (example document is enclosed)
2) The heat dissipitation data within the processor with operating frequency and peripherals utilized
3) The guidelines for effective removal of heat from the PCB as this forms hot spot for small form factor designs
4) The minimum heat sink needs to manage the temperatures well within the processor limits for operating temperature range of -40C to 60C
5) The maximum temperatures that processors can withstand (operating junction temperatures)
The above are needed for each of the three processors below
TMS320DM8168CYG2
- 1031 pin CYG package
TMS320C6A8168CYG2 - 1031 pin CYE package
This is very important here as form factor is very small
Thanks & Warm Regards,
Feroz