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Thermal analysis data request for Netra SOM module

Hi Netra Champs,

 

We need to support on

 

1)      Thermal Model (Impedance network) for simulation – starting from junction to package (example document is enclosed)

2)      The heat dissipitation data within the processor with operating frequency and peripherals utilized

3)      The guidelines for effective removal of heat from the PCB as this forms hot spot for small form factor designs

4)      The minimum heat sink needs to manage the temperatures well within the processor limits for operating temperature range of -40C to 60C

5)      The maximum temperatures that processors can withstand (operating junction temperatures)

 

The above are needed for each of the three processors below

TMS320DM8168CYG2 - 1031 pin CYG package
TMS320C6A8168CYG2 - 1031 pin CYE package

This is very important here as form factor is very small

Thanks & Warm Regards,

Feroz

  • Hello All,

     

    Any inputs on this please?

     

    We also need below data for DM8168 and C6A8168 :

    RΘJA - Thermal Resistance Junction-to-free air
    RΘJMA -  Thermal Resistance Junction-to-moving air

     

    Thanks & Best Regards,

    Feroz


  • Hello,

    Refer to the device power estimation spreadsheet for specific use case power estimates.

    The datasheet specifies that the Min/Max Operating junction temperatures are 0 to 95C.

    Refer to the app note SPRU811A for some general thermal design information.

    Regards,
    Marc

  • Feroz,

    The Theta JA and Theta JMA values shown in other datasheets are not relevant for the DM816x and C6A816x as for all applications a heat dissipative solution is required. We did not run the standard Jedec case for this device.  The resistance numbers from 2R models are listed below:

    Theta_jc = 0.21
    Theta_jb = 3.93

    Regards,
    Marc