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OMAP-L138: PLEASE SUGGEST AND CLEAR THE AMBIGUITY REGARDING DDR IN BOM OF LCDK-OMAPL138

satheesh kumar
Intellectual 460 points

Part Number: OMAP-L138
Other Parts Discussed in Thread: TMDSLCDK138

Dear sir,

We are working on LCDK OMAP L138 (which is ti evaluation board), now we want to make our own hardware (inhouse board)  by referring TI's design and BOM of LCDK OMAP L138 evaluation board.

Now there is a conflict that in actual evaluation board,TI has used W971GG6KB-25 sdram, while on TI's BOM it is mentioned both the part number W971GG6KB-25 and K4T1G164QF-BCE7.

Now we have two questions

1) Are both parts W971GG6KB-25 (Winbond) and K4T1G164QF-BCE7 (Samsung) same ?

2) Now W971GG6KB-25 is obsolete and K4T1G164QF-BCE7 is also available on very few sites.

Please suggest some alternate ddr which is compatible with your design as we have finalized the circuit and now our vendor is saying that ddr part is not available

Please help us as soon as possible.

Thanks in Advance.

Regards,

Satheesh kumar

  • 0
    TI__Guru**** 161600 points
    We're looking into this.

    Best Regards,
    Yordan
  • 0
    TI__Guru* 86125 points
    Hi Satheesh
    Please point me to the BOM material that is potentially confusing
    the history of DDR memory on various revs is somewhat captured here
    processors.wiki.ti.com/.../C6748_Development_Kit_(LCDK)

    In general you should be able to find memory vendors with similar timing / performance spec as this is all JEDEC compliant memories.
    We prefer not to recommend any specific one, but customers have used Micron, Winbond, Samsung DDR2 memories.

    If you have any specific memory vendor or part in mind, but not sure if that is suitable for the device, please feel free to put a follow up question.

    Hope this helps some.

    Regards
    Mukul
  • 0 in reply to Mukul Bhatnagar
    Intellectual 460 points

    Hi Mukul,

    I attached snippet of your TI's TMDSLCDK138 BOM for your reference.Here in manufacturing part column they mentioned  is W971GG6KB-25 and in Value column  they mentioned K4T1G164QF-BCE7.Please refer attached for more details.

    So as I early mentioned,our first question was whether can we use K4T1G164QF-BCE7 instead of W971GG6KB-25 without changing the circuit and footprint

    Regards,

    Satheesh

  • 0 in reply to satheesh kumar
    TI__Guru* 86125 points
    Hi Satheesh
    Thanks for highlighting the discrepancies in this thread and the other thread
    e2e.ti.com/.../2481439

    I will work with the EVM vendor on what updates can be done to ensure BOM and design files are reflecting consistent part numbers.

    >>o as I early mentioned,our first question was whether can we use K4T1G164QF-BCE7 instead of W971GG6KB-25 without changing the circuit and footprint

    Yes, i believe that is what was done on the EVM without any hardware/layout change and these should be foot print compatible.
    Let me know if you see it otherwise.

    REgards
    Mukul