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LMG3422R030: LMG3422R030RQZT

BAGADI RAJA SEKHAR
Prodigy 110 points
Part Number: LMG3422R030

Tool/software:

Dear  Team,

I hope this message finds you well.

I am currently studying the thermal design aspects of the LMG3422R030 Gan switch for theree phase inverter. i am also using LMG3422R030 BB-EVM evaluation board used in a synchronous buck configuration. I would appreciate it if you could kindly provide information on the thermal vias implemented under the LMG3422R030 device.

Specifically, I would like to know whether these thermal vias are filled with any material, and if so, could you please specify the type of material used?

Thank you for your time and support. I look forward to your response.

Thanks and Best Reggards,

B Raja Sekhar.

  • 0
    TI__Expert 4520 points

    Hello Raja,

    Here is an application note with some thermal design details for our 12x12mm QFN GaN parts: https://www.ti.com/lit/an/snoaa61a/snoaa61a.pdf 

    For thermal vias specifically, here are some guidelines:

    • Place thermal vias as close as possible, based on PCB manufacturer design rules
    • Standard via diameter of 24mil and hole size 12mil is recommended
    • Place thermal vias beneath thermal pad and around thermal pad to help heat spread over large surface area
    • When placing vias underneath the device solder pads it is necessary to use filled and capped vias
    • If they are not filled and capped, they will fill with the solder from the pad leaving solder voids underneath the device

    Thanks,
    Zach S

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