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SN65C1168E: Package problem SN65C1168ERGYR - thermal pad

Pawe? Milewski
Prodigy 10 points
Part Number: SN65C1168E

Hi!

I have a problem with the IC: SN65C1168ERGYR .
Does thermalpad need to be connected to GND? It's about the package VQFN16. The documentation does not contain this information.
www.ti.com/.../sn65c1168e.pdf

Thanks!

  • +1
    TI__Genius 15345 points

    Hello,

    The thermal pad does not need to be connected to GND. The thermal pad is there to help with the heat dissipation of the device so most of the time it is recommended that it is connected to GND since that is usually the largest copper pour on a PCB. However, you can leave it unconnected.

    Best,

    Chris