TUSB213: Power PAD

Mochi

Genius 3885 points

Part Number: TUSB213

Hello,

We are proceeding PCB layout design.

When look at TUSB213 EVM pattern layout, the Power PAD is not soldered to grand plane.

What is TI recommendation of Power PAD soldering on this device?

Since maximum power dissipation is 30mA max at 5V, Power PAD can be floating depends on environment temperature. Is that correct?

Regards,

Mochizuki

+1 Josh Baik over 1 year ago

Hi Mochizuki,

The thermal pad must be soldered to the printed circuit board for thermal performance and the proper ground reference.

Regards,

Josh

0 Mochi over 1 year ago in reply to Josh Baik

Genius 3885 points

Hi Josh,

Thank you for your prompt reply.

We will keep to place soldering via for Power PAD as usual.

Do you know why TUSB213 EVM does not have grand connection?

Is this just our CAD viewer setting problem?

Regards,

Mochizuki

0 Josh Baik over 1 year ago in reply to Mochi

Hi Mochizuki,

GND pad would not covered in the layout because TUSB213 EVM used the socket.

Regards,

Josh

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