SN65LBC180: Thermal resistance change

Kazuki Itoh

Part Number: SN65LBC180

Hi team,

My customer is using SN65LBC180RSAR and found that the thermal resistance has changed from 43.8C/W to 35.6C/W in the datasheet.
According to PCN, the device had design change of die shrink.
My customer assumes that the die shrink will make the distance between junction and case longer which will make the thermal resistance larger.
However, it's actually getting smaller.
Could you let me know how the design change (die shrink) made the thermal resistance smaller?

Best regards,
Kazuki Itoh

over 2 years ago

0 Parker Dodson over 2 years ago

TI__Guru 54042 points

Itoh-san,

In general your customer is correct -but a few devices under our design update program that is ongoing right now have seen a decrease in their thermal ambient to junction including this one. There are multiple factors that could determine this value just that die size is the most notable. All the information that we are sharing about the design change would be in the PCN letter.

Best,

Parker Dodson

0 Kazuki Itoh over 2 years ago in reply to Parker Dodson

TI__Genius 11300 points

Hi Parker-san,

Could you let me know some possible factors which decreased the thermal resistance?

I understand it's difficult to measure that, but my customer should wonder what can make the thermal resistance low.

Regards,

Kazuki Itoh

+1 Parker Dodson over 2 years ago in reply to Kazuki Itoh

TI__Guru 54042 points

Hi Itoh-san,

I can't discuss this anymore on the public forum - please reach out via the internal forum or through email.

Best,

Parker Dodson

Interface

Interface forum

SN65LBC180: Thermal resistance change