Other Parts Discussed in Thread: AFE4490, TMP117,
We are in the process of developing modular devices for our system, integrating sensors from Texas Instruments – AFE4490, AFE-DS1191, and TMP117. The communication interfaces for these sensors are AFE4490-SPI, AFE-SPI, and TMP117-I2C.
Each sensor is built on a separate PCB. AFE4490 and AFE-DS1191 will connect to the MCU via a USB connector. It's important to note that the USB connector is used only for board-to-board connecting purposes and does not serve as a USB interface. The mainboard had a one USB C female connector. Only one board(AFE4490/AFE-DS1191) is connected to the main board at a time via the UCB C connector. TMP117 connects via Pogo Pins, Please refer to the attached document for a detailed look at the block diagram.
https://drive.google.com/file/d/1UiTXFteam8fYgxxR-UmdIdSTkzRdp82Y/view?usp=sharing
Sensor attachment and detachment can occur without powering off the device(Hot Swap). I'm curious to know if this modular concept will function seamlessly without any issues.
1. During the development of this modular concept with hot swap, what hardware design considerations should be taken into account?
2. Additionally, could you recommend any specific ICs or solutions to ensure the successful implementation of the modular system with Hot Swap?
Thanks
Regards
rajkumar