SN65HVD1782: Bimetallic wirebonding to IC die

Brandon Cummings

Part Number: SN65HVD1782

Tool/software:

I had a risk concern for purple plague corrosion come up for SN65HVD1782QDRQ1 and other automotive ICs. The Material declaration for these parts includes the use of Au wire bonds and die metallization materials as TiW, Al, CU alloy.

Question: Regarding the specific alloy composition of the bond wire and die surfaces, are there any mitigation towards Bimetallic wirebonding to IC die involving Au and Al? Is there any construction related processes, such as low heat bonding, to prevent this issue in your products?

4 months ago

0 Ethan Sempsrott 4 months ago

TI__Expert 7156 points

Hi Brandon,

Can you please share with me the material declaration you are referring to? The materials you listed are off from what I am seeing on my end.

Best,

Ethan

0 Brandon Cummings 4 months ago in reply to Ethan Sempsrott

Prodigy 10 points

Hi Ethan, thanks for the response. I was reading from the PPAP data, page 7, section 11.a. Die metallization material(s): TiN/AlCu (0.5%). I may be reading this wrong. Should I be referring to a different section to clarify the contact surface alloys which the bond wire bonds to?

0 Ethan Sempsrott 4 months ago in reply to Brandon Cummings

TI__Expert 7156 points

Thanks for the information Brandon.

I cannot share information regarding PPAP material since this is a public forum. The best way for you to move forward is to contact your sales representative with your question. I apologize for having to defer you, but that is just the legal process with IP at that level.

If you need any other help with schematic reviews, device operational questions, etc., feel free to ask that here.

Best,

Ethan

0 Brandon Cummings 4 months ago in reply to Ethan Sempsrott

Prodigy 10 points

Thank you Ethan,

I am have trouble finding a TI contact that I can bring this question to separate from this form. Would you be able to help open up a communication path? I appreciate your time.

+1 Ethan Sempsrott 4 months ago in reply to Brandon Cummings

TI__Expert 7156 points

Brandon,

I just emailed your representative with your information. He is on business travel until Friday so there might be a slight delay in his response. I will keep you updated if I learn of anything new on my end.

Interface

Interface forum

SN65HVD1782: Bimetallic wirebonding to IC die