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HVD251 SON8 thermal pad to ground?

Matt Alder
Prodigy 10 points
Other Parts Discussed in Thread: SN55HVD251

Hopefully a really simple one...

I'm designing a board using the SN55HVD251 SON8 package.

I assumed I could connect the thermal pad to ground - but I can't find confirmation for that in the datasheet.

Can you confirm it's OK to connect the SN55HVD251 exposed pad to ground?

Thanks.

  • 0
    TI__Mastermind 20590 points

    I am checking with design for the device and will confirm.  Normally the thermal pad will may connected to Ground for devices like this but we will confirm and later add this missing information to the datasheet.

    Thanks, Scott

  • 0 in reply to Scott Monroe
    TI__Mastermind 20590 points

    I have confirmed that the internal electrcial is a NC on the device so it fine to connect the thermal pad to Ground electrically.  From a thermal perspective this is preferred method as the connection of the power pad to GND will offer a very good thermal path for the heat to dissipate.  We will add this clarification to the datasheet.  Thanks for asking the question and bringing this ommission to our attention. As a reference use the following for now:

    PCB and Thermal Considerations for SON Package

    The SON package verson of this device has an exposed thermal pad which should be connected with vias to a thermal plane. Even though this pad is not electrically connected internally it is recommended that the exposed pad be connected to the GND plane. Please refer to the mechanical information on the package at the end of this datasheet and application report SLUA271 "QFN/SON PCB Attachement"  for more information on proper use of this package.

    -- Scott