SN65LVDS2

Hi Eli,

The maximum junction (die) temperature for this device is 150 C. Since this device's power dissipation is low (typically 60 mW) and there is strong thermal conduction from the die to the top of the package (20 C/W would be a conservative estimate for the thermal resistance), the die should only be a few degrees warmer than the case. As long as the case temperature is below about 145 C then the junction should be below its maximum temperature.

Note that this maximum is an "absolute maximum" - i.e., it relates to the lifetime reliability of the device. In terms of parametric performance, this was characterized based on a maximum ambient temperature of 85 C (as documented in the electrical characteristics tables).

Let me know if you have any other questions.

Regards,
Max