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DS15BA101: Standoff and coplanarity of the pacakge

Oba
Genius 16445 points
Part Number: DS15BA101
Other Parts Discussed in Thread: DS15EA101,

Hello,

 

I want to know coplanarity and standoff parameter of the below devices:

 

DS15EA101

DS15BA101

 

But I can’t find these information in the datasheets.

I think QFN/SON package is usually 0.05 standoff and 0.08 coplanarity like the below figure(this is from RGX package).

 

 

Question 1)

Could you please tell me standoff and coplanarity value for each devices?

 

Question 2)

Are pin and power pad on the same plane? If not, could you please tell me standoff value of the power pad?

 

 

 

Regards,

Oba

  • 0
    TI__Mastermind 29655 points
    Hi Obata-san,

    The package you are referring to (RGX) is different from the DS15BA101 (WSON) and DS15EA101 (WQFN). The pins of the RGX package extend below the package, causing there to be 2 different planes. The WSON and WQFN do not have such a case, and they share the same plane.

    1. Standoff height is 0, since the pads for the device pins do not protrude from the bottom of the IC. Also, because the pins do not protrude from the IC and the bottom of the IC is flat, coplanarity is also 0.

    2. Pin and power pad are on the same plane.

    Thanks,

    Michael
  • 0 in reply to Michael Lu (Santa Clara)
    TI__Mastermind 29655 points

    HI Obata-san,

    I did some additional investigating regarding your question to see what our packaging team says.

    It turns out that the values you see (0.05mm maximum standoff and 0.08mm coplanarity) are specified per JEDEC standards for all WQFN/SON packages. TI follows these standards, and thus these tolerances are included with the package for the DS15BA101.

    As such, the DS15BA101 NGQ package will have the same specifications.

    Thanks,

    Michael