SN65LVDS387: DGG package

manu mohan

Intellectual 410 points

Part Number: SN65LVDS387

Please share me the thermal details above part.

Maximum junction temperature (Tj)

case to junction thermal resistance (Rjc)

board to junction temperature(Rjb)

over 6 years ago

0 Yaser Ibrahim over 6 years ago

TI__Genius 10250 points

Hello Manu,

We don't have this data readily available. I will try to find this data and get back to you.

Regards,
Yaser

0 manu mohan over 6 years ago in reply to Yaser Ibrahim

Intellectual 410 points

Hi,

Please let me know the details immediately because we are holding the thermal analysis of our system due to this.

0 Yaser Ibrahim over 6 years ago in reply to manu mohan

TI__Genius 10250 points

Hello Manu,

Here are the thermal parameters for this device :
Theta JA-High K: 65.1
Theta JC, top: 18.8
Theta JB: 37
Psi JT: 0.9
Psi JB: 36.6

The maximum junction temperature is 125 C. However, the the device's performance and electrical parameters were characterized only over the ambient (free-air) temperature range -40 C to 85 C.

Regards,
Yaser

0 manu mohan over 6 years ago in reply to Yaser Ibrahim

Intellectual 410 points

Thanks, Yser

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SN65LVDS387: DGG package