DS16F95QML: Coefficient of Thermal Expansion (CTE) for 2 Parts

David Weisenberg

Intellectual 510 points

Part Number: DS16F95QML

Hi! I'm doing a solder joint analysis for an assembly that uses a LOT of T.I. parts, including 2 interface parts.

Can you please tell me the coefficient of thermal expansion for the following parts:

DS16F95QML

SN65HVD233MDREP

(The first one is higher priority.)

Thanks in advance -- I appreciate the help!

over 6 years ago

0 Wade Vonbergen over 6 years ago

TI__Guru 62930 points

David,
The ceramic (alumina) package has a CTE of 7.2ppm/K for the DS16F95QML. I am not sure if this is sufficient for your analysis.

I will need to research more for the mold compound on the SN65HVD233MDREP and get back to you.

Regards,
Wade

0 David Weisenberg over 6 years ago in reply to Wade Vonbergen

Intellectual 510 points

Thanks! The package CTE is exactly what I need. This is extremely helpful!

Thanks also for looking into the other part.

0 Wade Vonbergen over 6 years ago in reply to David Weisenberg

TI__Guru 62930 points

David,
All of the CTE's for the plastic encapsulated devices will have the same result as noted in this e2e post: e2e.ti.com/.../789140

The CTE of mold compounds is considered NDA and will take more effort to provide if necessary. For BLR and solder studies, I would expect that the mold compound has minimal to no influence compared to the leadframe.

Regards,
Wade

0 David Weisenberg over 6 years ago in reply to Wade Vonbergen

Intellectual 510 points

Great! Thanks!

Interface

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DS16F95QML: Coefficient of Thermal Expansion (CTE) for 2 Parts