The datasheet recommends using both a RF ceramic type bypass cap and a tantalum electrolytic bypass cap. It recommends a range of 0.01 uF to 0.1 uF for the RF ceramic, but does not make a recommendation for the tantalum electrolytic type. Is there a guideline for how to select the value of the tantalum electrolytic cap for our design?
Our application is using this IC in both 1:2 splitter and 2:1 MUX configurations. The LVDS signals have a variable data rate from 2 Mbps to 400 Mbps.
(Also, if this is a double-post I apologize, I'm not sure if I was logged in when I submitted the question the first time).
