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U13 in image below, shows a National Semiconductor DS26C31TM with part marking "65CCYDUE0".
Date code on received paperwork is 1619. I understand in the part marking, "65" is wafer fab and assembly plant as shown but how to decode the date code? Please provide some documentation as this problem occurs frequently. Also have a device with marking "55AYK8UE0" that needs decoding.
Not sure how to attach a file here. When I use the paper clip, it inserts an image. Can you supply the documentation you refer to?
devicemarkingconventions.pdfI've tried attaching the file on part marking conventions. But can you tell me the format of the marking that you are referring to?