Hi Sir,
can the component withstand at least 3 time or 2 time of reflow 260 deg. 10 second temperature production condition?
because ti the reflow profile data can't see this condition.
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Hi Sir,
can the component withstand at least 3 time or 2 time of reflow 260 deg. 10 second temperature production condition?
because ti the reflow profile data can't see this condition.
Hi Tommy,
Thanks for reaching out to us.
The ISO1640 devices qualify to the JEDEC JESD-020 profile with a peak reflow temp of 260C, the peak temperature shouldn’t exceed 260C. Please see the below document for more details and the temperature profile.
https://www.ti.com/lit/an/spraby1a/spraby1a.pdf
Regards,
Koteshwar Rao
Hi Koteshwar Rao,
we have a confuse question:
we see the profile page 5 montion three reflow cycle for this package is can be.
so it mean that the thickness of the package less than 1.6mm, right?
==>The IC packages are classified according to J-STD-020 and withstand three reflow cycles.

Hi Tommy,
Thanks for your further question.
Mentioning of running three reflow temperature cycles is in reference to all packages with all thickness. By looking at ISO1640 datasheet for device thickness, I found out that the thickness of device is about 1.75mm. Thanks.
Regards,
Koteshwar Rao
Hi Koteshwar Rao,
thank for yuor reply.
the thickness is 1.75mm, same range, so is no probiem, right?

Hi Tommy,
Yes, thickness 1.75mm with the row highlighted in the image is fine. Thanks.
Regards,
Koteshwar Rao