This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

ISO7241C-Q1: Bond Wires difference in automotive and industrial variants

Part Number: ISO7241C-Q1
Other Parts Discussed in Thread: ISO7741-Q1, ISO6741-Q1

Hello,

I wanted to know the difference between the ISO7241 automotive variant (AECQ certified) and industrial variant. I saw in the QRP packaging datasheet that the amount of gold in the bond wires is less in the industrial grade version of this IC. Could you provide some information about how much thinner the bond wires of the industrial variant are compared to the automotive variant. Also would it be recommended to use the industrial part in a safety critical area (ASIL C) given the lack of testing of the bond wires in the industrial part?

many thanks and regards 

  • Hello Furqan,

    Thank you for your question and welcome to E2E!

    Searching the part on Material content search | Texas Instruments (ti.com) will show a Restricted chemical test report will have details on the materials used in the devices for safety and reliability purposes including bond wire type and material quality, Information on bond wire thickness, however is not information we share. All of the tools provided on Quality & reliability | TI.com is the information that we can publicly provide.  In general, we do not provide information on the internals of these devices beyond what is found with the public tools above

    Since ASIL C is an automotive standard, it would  preferable to use the automotive grade part since the device has been tested to meet automotive standards

    Also, I would like to mention that ISO7241C-Q1 is an older device. If you would like to use the most recent devices in the portfolio, please consider the ISO7741-Q1 and ISO6741-Q1.

    I hope this helps. 

    Best,

    Andrew

  • Hi Andrew,

    many thanks for your quick response. I have noted the newer versions of the isolator. However, as you know the semiconductor shortage is hitting us all hard and availibility of these ICs could be a problem. Therefore it was suggested by our supplier to use the industrial grade version of the isolator. As part of the team responsible for releasing the part, however, I have reservations about the ability of the wire bonds of industrial grade IC to withstand the high current/ voltage spikes that might arise (it is used in the current-voltage sensor of the safety box - hence the ASIL C). If you could provide us atleast with this information, it will be helpful to us to reach a decisive conclusion - i.e. are the wire bonds of the industrial grade IC durable enough to withstand the high current/voltage spikes that might arise in a current/voltage sensor?

  • Hello Furqan,

    Thank you for the additional information as to why you are looking into using the industrial grade ISO7241C-Q1. 

    Unfortunately, we can not share the wire bond information details. If you can provide what high current/voltage spikes you expect to see in your current-voltage sensor and on what pins of our device these transients may appear, then we will be able to tell you if the industrial grade part durable enough to withstand the high current/voltage spikes that might arise.

    Best,

    Andrew