Dear Support Team,
I have a question on whether we can achieve a Creepage > 8mm for the board on which ISOUSB211 is mounted (NOT ISOUSB211 itself).
1. According to the ISOUSB211 datasheet (Rev.C, page 7), the Creepage is >8mm.
2. However, according to the same datasheet page 41 (also in the Gerber file of ISOUSB211DPEVM, TOP layer), the shortest distance between the copper land pattern of side-1 and side-2 is only 7.3mm (9.3 - 1 - 1 = 7.3), which is less than 8mm.
3. There should be an "Air Gap" between the bottom side (black resin) of the ISOUSB211 chip and the mounted board surface. The datasheet indicates the "Air Gap" height to be between 0.1mm and 0.3mm (see page 40, lower-right).
4. There should be a risk that the Creepage distance equals 7.3mm if using your recommended land pattern, since there exists such an "Air Gap" creeping discharge path between the land patterns of side-1 and side-2 through the surface of the mounted board.
I understand that the Creepage distance of the ISOSUB211 chip itself is >8mm, there is no doubt here.
But when I mount it on a board, how can I achieve the Creepage > 8mm at the board level?
(With high possibility, I have a misunderstanding about Creepage defined in many IEC 60***-1 standards, but I can not find a suitable description.)
Thank you in advance.
