ISOW1432: Layout Guidelines of ISOW1432BDFMR

Kenta Yajima

Part Number: ISOW1432
Other Parts Discussed in Thread: ISOW7741

Tool/software:

Regarding Layout Guidelines of ISOW1432BDFMR, it seems that we should not have any metal traces or ground pour on the Keep-out zone for any metal.

But customer may not able to keep this guidelines. When it is not observed, what kind of bad influence you can expect? Only EMI?

1 month ago

0 Michael J Schultis 1 month ago

TI__Mastermind 24885 points

Hello Yajima-san,

Please refer to our EVM for an optimized layout for the iSOW1432:

https://www.ti.com/tool/ISOW1432DFMEVM

Which keep out zone are you referring to?

Best,

Michael

0 Koteshwar Rao 1 month ago

TI__Guru 54765 points

Hi Yajima-san,

Thank you for reaching out.

Not maintaining a Keep-Out Zone (KOZ) in the PCB layout between device supply nodes and system supply nodes can lead to higher radiated emissions issue. This only affects Radiated Emissions and doesn't affect device operation or electrical performance. Please refer to the below application note that talks about KOZ briefly. The document refers to ISOW7741 but is equally applicable to ISOW1432 as well, thanks.

How to Meet CISPR 32 Radiated Emissions Limits With ISOW7741

Regards,
Koteshwar Rao

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ISOW1432: Layout Guidelines of ISOW1432BDFMR