ISO7740: PCN#20241220002.0 PCN#20250417001.1 Changes in Specification

Hi Thomas, 

I would like to clarify the PCN updates below:

PCN# 20230830001 - moved device to an additional fab site, RFAB. Due to this the design was updated and caused the PWD spec to change.

PCN#20241220002 - datasheet update is related to the design update due to PCN# 20230830001

PCN#20250417001 - No spec changes were made from this PCN

Considering the above, the PWD spec and other specifications were changed in order to better represent the device design updates that occurred in PCN# 20230830001.

Regards,
Aaditya V

Hi Aaditya,

This helps to understand why the specifications changed.

Is there data / qualification reports available to get more insight, why the maximum specification (PWD) is increased by about 20%.

What does the gauß curve and the normal distribution look like?

Best regards,

Thomas

Hi Thomas,

Thanks for your reply.

Thomas Ganahl said:

Is there data / qualification reports available to get more insight, why the maximum specification (PWD) is increased by about 20%.

As mentioned before, the design was updated and caused the PWD max spec to change. In terms of data and gauß curve for the PWD, we can not provide this information. The quality and reliability report can be found here: https://www.ti.com/quality-reliability-packaging-download/report?opn=ISO7740DBQR

Regards,
Aaditya V

Hi Thomas,

I saw that you rejected the previous post. Please let me know if you have any doubts or additional questions in regards to my previous answer. 

Since E2E requires a resolved post, I will be marking this as resolved. I you still have any questions, please feel free to reach out.

Regards,
Aaditya V

Hi Aaditya,

What did you expect? You are not able to give me the information I need.

I now need to wait for the samples and perform release tests for 10 designs, and in the worst case, switch to another vendor for some of them
because the design update (PCN# 20230830001) was anticipated with NO impact on form, fit, and function. But one and a half years later, you change the datasheet to accurately represent the device performance after the design `update` with 20% or even worse specification.

Detailed information about the measurement results and the distribution that led to the extension of the specification and the datasheet change would help me to assess the risk/impact on the design, before doing all release tests again.

I won't accept this post to be resolved.
I'm frustrated because in the last months I compared about 10 updated TI datasheets, because often the anticipated NO impact on form, fit, and function ended up in a completely different device one and a half years later, after getting the datasheet updated.

Hi Thomas.

We apologize for delay in datasheet updates in regards to the PCN. I understand your frustrations and would still like to help you. Can we reach out to you over email to further discuss your requests?

Regards,
Aaditya V

Hi Aaditya,

yes just contact me via email.
We anyhow have a valid NDA with TI so maybe we can go into the details there.

BR
Thomas

Hi Thomas, 

Thank you. I will reach out to you over email and close this E2E.

Regards,
Aaditya

Still waiting for your email ...

Hi Thomas, 

I had sent an email to you right after we discussed last time. Can you please check again? it is possible that the email is in spam folder or junk folder. I will also push my previous email again.

Regards,
AV