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ISO1050: ISO1050 cross-testing problem

Part Number: ISO1050

Dear TI team,

ISO1050DUBR, DC22+ and DC25+. We conducted cross-testing using these two batches of chips.

DC22+ display normally. However, the 25+ pins show an increase in resistance at pins 7 and 8.

We sent these chips for decap. However, we found that the internal bonding materials were different. Could this be the reason why the 25+ chip didn't pass the cross test? But we couldn't find the PCN change file on the official website. This is puzzling me. Please help me check this problem, as I may need to adjust software compatibility. Thank you.

  • Hello,

    Thanks for reaching out.

    Please give us a few extra days to get back due to the Holidays.

    Regards,
    Varun

  • Hello Kathrine, 

    Thank you for reaching out. I understand that you have observed a difference between two batches of ISO1050. Can you please include or confirm the following details?

    1. Confirm that both devices were purchased from TI.com or an authorised vendor. Anti-counterfeit | Quality policies & procedures | TI.com
    2. Attach a picture of the package labels on the reel/package of both batches of devices. 
    3. Attach pictures of the topside and bottom side markings of both devices (if possible, I understand that these were decapsulated)
    4. Include a schematic to show what ISO1050DUBR, DC22+ and DC25+ is connected to. 
    5. Please also include the resistance measurements and how they were measured when unmounted from a PCB. 

    Best,
    Andrew