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ISOM8113: Package difference, DFG v DFH

Joe Kearney
Prodigy 10 points

Part Number: ISOM8113

I am a parts engineer at Northrop Grumman.

I am working to get approval to purchase ISOM8113DFGRQ1. Approval was received to purchase isom8113dfhrq1.

The only difference I see is the package outline, DFG v DFH. What is the difference between the two?

 

  • 0
    TI__Genius 17630 points

    Hi Joe,

    Thanks for reaching out and your interest in ISOM8113.

    Summary: The electrical characteristics (CTR range of 375%–560%, isolation ratings, VCE, temperature range, etc.) are identical between DFG and DFH. The only real difference is the lead/pin pitch (footprint spacing): DFG uses the standard 2.54mm pin pitch, while DFH uses a narrower 1.27mm pin pitch. This affects the physical footprint size on your PCB (DFH is a more compact package) but does not affect performance.
    There's also a third option in this family, DFS (also 2.54mm pitch but different body/pocket size), for reference.

    DFG vs DFH — Both are 4-pin SOIC packages, but with different pin pitch/lead spacing

    Attribute DFG (ISOM8113DFGR) DFH (ISOM8113DFHR)
    Package 4-pin SOIC 4-pin SOIC
    Pin pitch 2.54 mm 1.27 mm
    Package Dimensions from Datasheet
    Footprint Dimensions from Datasheet
    Bottom line for your approval: Since DFG and DFH share the same die and electrical/performance specs, the difference is purely mechanical/footprint (pin spacing and package outline dimensions) — not a functional or electrical difference. If the narrower pitch footprint is acceptable in your PCBs, then DFH can work just fine.
    Regards
    Varun