Other Parts Discussed in Thread: ISO7841,
1. In TI app. note "Understanding failure modes in isolators" is described ISO7841, with internal structure consisting of two dies, thus providing reinforced protection.
Does ISO7741 have same internal structure consisting of two dies, for reinforced protection? (Does perhaps "double protection" term which would better describe two-die structure, rather than reinforced protection, if each die provides basic isolation?)
2. In ISO7741, there is table "Safety Limiting Values". If case of some fault state on board, e.g. short to ground when pin current (supply or I/O) is bigger than rated safety current, is it possible that I/O isolation simultaneously fails (on both dies)? Can this scenario be compared with "Fault mode 2" from mentioned app. note?
Best regards,
M.Babic