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Hello team,
I would like to know if the DW and the DWV package is capabale of immersion in wave solder?
I found this document for SOIC packages:
Thanks!
Best Regards,
Mat
I found this, so it should be allright as long as it is within the MSL compliant temp range?
Hi Mat1980,
Thanks for posting to E2E! We do not specify wave soldering parameters for digital isolators, but as written in the earlier thread this should be okay for ISO774x within the Peak Temp rating of 260dC. The main concern for wave soldering here arises from the adhesive used to hold ICs to the PCB: please ensure the adhesive or tape will not melt or degrade during the solder process.
I will contact our packaging team to confirm and follow up if needed.
Best,
Manuel Chavez
Hi Mat1980,
Since processes can vary from customer to customer, please encourage post-processing to evaluate device and board performance after undergoing wave soldering. TI's devices can typically withstand wave soldering within the MSL and Peak Temp thermal stress constraints (specifics in Section 4 of this document), but it is not guaranteed. As mentioned above, some adhesives may also not reliably hold devices to the PCB during wave soldering.
These points are not typically concerns, but for our customers to keep an eye out for.
Thank you,
Manuel Chavez