Other Parts Discussed in Thread: OMAPL137-HT, SM320F28335-HT, OMAP-L137, SM470R1B1M-HT
The TMDS-FET470R1B1M IAR Kickstart Development Kit is obsolete. What are some other hardware development tool options?
This thread has been locked.
If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.
Other Parts Discussed in Thread: OMAPL137-HT, SM320F28335-HT, OMAP-L137, SM470R1B1M-HT
The TMDS-FET470R1B1M IAR Kickstart Development Kit is obsolete. What are some other hardware development tool options?
Rob,
For this part the only official EVM we really seem to have would be the heat EVM: http://www.ti.com/tool/heatevm
While this might be overkill, I will continue to look into what else we might have for this part, but is there a chance that a newer TMS470M part would work in this application?
-Reagan
A newer TMS470M part will not work as either 175C or 210C operation is required.
What design kits and EVMs are available for the 175C OMAPL137-HT?
Also I am aware of the 210C SM320F28335-HT design kits.
Rob,
Would they need the EVM used to have high temp capabilities? For a lot of these parts, the EVMs won't actually have the high-temp version of the parts. This is true for the OMAPL137 and F28335 high temp parts as well.
-Reagan
No just need the eval boards for software development and possibly interface at room temperature only.
Rob,
With that in mind, I would just look at the Design Kits & Evaluation Modules section for each product folder of the non-high-temp versions of the devices you're looking into. As an example, the OMAP-L137 starter kit (http://www.ti.com/tool/tmdsoskl137) can be used to evaluate that platform.
Unfortunately with the SM470R1B1M, the only thing would be the HEAT EVM.
Rob,
We have an SM470 EVM with the ceramic component on it thru IAR, but they need to build more to get it back up on their web. I'm working with them to make this happen. For the OMAPL137,-HT as Reagan suggests best path is to use a commercial EVM for SW and eval, and when they are ready for temp testing they can put the HT plastic version on (pin compatible to the commercial PTP package). Same is true for the F28335-HT. HT plastic will be pin-compatible to the commercial plastic package (PTP).
Charles
Thanks Charles.
RE: We have an SM470 EVM with the ceramic component on it thru IAR, but they need to build more to get it back up on their web. I'm working with them to make this happen.
Will the part number be: TMDS-FET470R1B1M (IAR Kickstart Development Kit)? My customer sees that there is one available through some web reseller but wants to make sure it is the right one for the SM470R1B1M-HT – ARM7 Microcontroller.
What is the timeline for the new SM470 EVM availability?
BR,
Rob