Can the SM470R1B1MHFQS be mounted without lead forming, like the classic MIL surface mount parts it resembles?
My customer is aware of the lead formed SM470R1B1MHKPS.
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Can the SM470R1B1MHFQS be mounted without lead forming, like the classic MIL surface mount parts it resembles?
My customer is aware of the lead formed SM470R1B1MHKPS.
Hi Rob, if I may interject... I'm the HiRel packaging engineer.
Classic Mil surface mount parts are rarely mounted unformed to our knowledge since the lead compliance of gull wing form is critical to board level reliability under temp cycle and mech shock. The reason Mil parts are sold unformed is because of the different methods end customers use to mount them. Film underfill epoxy requires lower stand off than liquid injected epoxy, and if a heat pad or slug is present solder mount requires a different stand off than either, typically. Additionally, over the years various customers have adopted their own foot print standards and there is no universal agreement.