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THS4511-SP: THS4511-SP board layout considerations for the ceramic dual flatpack

m ruiter
Prodigy 20 points

Part Number: THS4511-SP

Hi all,

1. Is there a gerber file available for the ceramic dual flatpack option available?

If not, what should be considered in layout?

The long leads will add additional inductance compared to the smt version.

/Mark

  • 0
    TI__Genius 14540 points

    Hi Mark,

    We did not build a marketing EVM when we released the THS4511-SP.  Instead, we point users to the commercial EVM for device evaluation.  Here is the link to the trim and form specification which we have used at Fancort.  Users are welcome to trim and form the device as they see fit as there are tradeoffs to be made with board level reliability (BLR) and the trim and form. 

    www.fancort.com/.../16LEADFP.pdf   

    Regards,

    Christian