Hello,
We have performed pull test on the bondings of this part and were very surprized to see the pads lifting. I precise the mold compound has been removed with nitric acid (5 volume) and sulfuric acid (1 volume).
Looking further, we have noticed with xray fluorescence equipment a high concentration of copper on the die. Our question is : what is the top metal of the die ? AlCu.5 as written in reliability datasheet or Cu ?
Best regards
