SN74HCS74-Q1: SN74HCS74BQA-Q1 Die and package question

Imelda Zhang

Part Number: SN74HCS74-Q1

Tool/software:

Hi Expert,

I have several questions to check with u.

For QFN package, is die-to-package ratio qualification checked? Is it single die or multi die? Is it asymmetric die in the package? The board level reliability qualification of this type of die and package construction shall be done.

Many thanks for your help!

Kind Regards

Imelda

2 months ago

0 Malcolm Lyn 2 months ago

TI__Mastermind 19410 points

Hi Imelda,

Could I ask who the customer is? This is information we'd prefer to share either over email or on the internal forum.

Best,

Malcolm

0 Imelda Zhang 2 months ago in reply to Malcolm Lyn

TI__Expert 4265 points

Hi Malcolm,

The customer is Joyson. We do have NDA with them. You can send email to me directly.

Kind Regards

Imelda

+1 Malcolm Lyn 2 months ago in reply to Imelda Zhang

TI__Mastermind 19410 points

Hi Imelda,

I have added you on email. I'm going to close this thread now.

Best,

Malcolm

Because of the Thanksgiving holiday in the U.S., TI E2E™ design support forum responses may be delayed from November 25 through December 2. Thank you for your patience.

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SN74HCS74-Q1: SN74HCS74BQA-Q1 Die and package question