Tool/software:
Is it possible not to solder the thermal pad of the WQFN package to the PCB? From a thermal perspective this shouldn't be an issue, but what about the mechanical stress onto the PINs?
Is the exposed pad connected to any internal signal or galvanically isolated?
Thanks and regards
Alex
Hi Owen, thanks for the information. The E2E thread doesn't answer if the exposed pad is internally connected to a signal. it can be connected to GND or be left floating. Does this mean it is internally connected to GND? Also, the d/s says for optimal mechanical performance it should be soldered. But the question is, will there be an issue not soldering the pad?
Thanks
Alex
From the QFN and SON PCB Attachment Application Note:
The die/substrate usually is at the most negative potential, i.e., GND for logic devices. The die bond material might or might not be electrically conductive.
The FAQ says that you do not need to solder the pad. But it improves the mechanical stability, and the board space under the pad cannot be used for anything else (solder mask is not a reliable electric isolator), so there is no reason not to solder it down.
