SN74LVC2G17: SN74LVC2G17YZPR

Tzvetanka Djambova

Part Number: SN74LVC2G17

Tool/software:

Hello Technical Support Team,

We need your support in order to investigate an issue related to the Schmitt Trigger Buffer part - MPN: SN74LVC2G17YZPR. The Quality Engineering informed me that the tops of some parts are chipping out.

Could you please provide detail structure of the component including the materials of the top layers are made.

It is urgent and I appreciate your quick response.

Thanks,

Tzvetanka

7 months ago

0 Owen Westfall 7 months ago

TI__Genius 12841 points

Hi Tzvetanka,

The material content for this device can be viewed https://www.ti.com/materialcontent/en/report?pcid=237010&opn=SN74LVC2G17YZPR

While I look into the structure could you provide more detail on what "chipping out" means with perhaps some pictures that I can forward to our teams to investigate the cause.

Regards,

Owen

0 Tzvetanka Djambova 7 months ago in reply to Owen Westfall

Prodigy 10 points

Hi Owen,

Thanks for the response. Please see the pictures illustrating the issue.

0 Owen Westfall 7 months ago in reply to Tzvetanka Djambova

TI__Genius 12841 points

Hi Tzvetanka,

Just to be clear these devices are not arriving like this? It is just some devices during pick and place seem to be getting damaged?

Regards,

Owen

0 Tzvetanka Djambova 7 months ago in reply to Owen Westfall

Prodigy 10 points

Hi Owen,

Originally when we received the components from the TI distributer we did not notice defects on top of the components.

After the re-balling process we found the issue ( tops are chipping out). According to the BGA company these chips are extremely brittle. They are very well handled but because the top material is very brittle always there is a high risk of damages.

I would like to ask you are you able to provide pass/fail criteria (measure some parameters) to be implemented after re-balling process to make sure the defects on top of the components will not affect the performance of the components?
Taking in consideration the material on the top of the component we would like to know will these defects propagate during the reflow process and impact the performance and reliability?
Does TI provide re-balled parts?

Thanks,

Tzvetanka

0 Owen Westfall 7 months ago in reply to Tzvetanka Djambova

TI__Genius 12841 points

Hi Tzvetanka,

I think all this information would be better handled by the Customer Support Center. Please file a ticket with them, and they will be able to get all that information for you.

Regards,

Owen

0 Tzvetanka Djambova 7 months ago in reply to Owen Westfall

Prodigy 10 points

Hi Owen,

I used Customer Support Center to submit my request originally. Are you able to provide a specific link where I can forward my questions. Thanks, Tzvetanka

0 Albert Xu1 7 months ago in reply to Tzvetanka Djambova

TI__Mastermind 37565 points

Hi Tzvetanka,

Please try using the link here: https://www.ti.com/info/customer-support.html

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SN74LVC2G17: SN74LVC2G17YZPR