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SN74AUP1G04: Solder mask

SimonF
Expert 3170 points
Part Number: SN74AUP1G04

Hi Team,

I got the following question can you please check:

I’m drawing a footprint for the SN74AUP1G04 Low-Power Single Inverter Gate and I’m not sure whether ‘solder mask opening’ should be really smaller than ‘metal under solder mask’ like it’s shown on the drawing below. Could you check and confirm this matter for me please?

 

Thank you and best regards

Simon

  • 0
    TI__Guru* 96937 points
    Hi Simon,
    Yes, the pads for this device are defined by the solder mask, not by the metal underneath. The overlap provides added physical strength to the joint -- ie instead of only having a tiny pad of metal holding the part down, now the solder mask is also helping to hold it down.

    The industry standard overlap for this is 50um, although I have seen smaller overlaps work in some designs, down to 20um.