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Original question:

SN74ABT541B: Octal Buffer

SN74ABT541B: Thermal Characteristics

Liu Yang
Expert 6245 points
Part Number: SN74ABT541B

Hi Team,

What is the thermal resistance (C/W) from junction to case top and bottom for the SN74ABT541BDBR?

Beat Regards,
Tom Liu

  • 0
    TI__Guru* 96862 points

    Hi Tom,

    We don't provide case to bottom thermals for this type of package since there is no thermally conducting pad on the bottom of the device. Adding any epoxy from the plastic bottom of the package to the board is not going to help with thermal transfer because the vast majority of the thermal conductivity is going to happen through the leads.

    I would not recommend adding an epoxy to the bottom of the chip, as any thermal benefit would be negligible.

    I will submit a request to our thermal modelling team to get the standard thermal values for this device. Because of the holidays, I expect the results will take 3 to 4 weeks.

  • 0 in reply to Emrys Maier
    TI__Guru* 96862 points

    Result- Theta JA-High K (standard datasheet value)

    		 88.4

    Result-Theta JC, top (standard datasheet value)

    		 46.0

    Result-Theta JB (standard datasheet value)

    		 44.3

    Result- Psi JT (standard datasheet value)

    		 11.9

    Result- Psi JB (standard datasheet value)

    		 43.8