We see that the TMS320F28075PTPT has a big thermal pad in the center of the package to be footprint compatible with other higher performance device variants. However the large ground pad causes excessively large PCB size for our TMS320F28075 application. Is it possible to reduce the size of ground pad on the PCB and still meet thermal requirements? Our application has an ambient of 50 Degrees C Max. If this is acceptable please let us know the minimum dimensions of the PCB ground pad we can use.
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