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TMS320F28377S: The PowerPAD layout

Luke Chen
Expert 5090 points
Part Number: TMS320F28377S

Hi champs,

My customer is using 176-PIN F28377S and wants to know more about the PowerPAD layout, please advise your comments on below questions,

  1. In datasheet we suggest 0.2 mm diameter via and Application Report slma002h suggests 0.33 mm diameter via, which suggestion is better?
  2. On the back of PowerPAD, what method is recommended to get better heat dissipation? Is there any risk if customer uses bare copper like the front of PowerPAD?

Regards,

Luke

  • 0
    TI__Mastermind 45236 points

    Hi Luke,

    Luke Chen said:
    In datasheet we suggest 0.2 mm diameter via and Application Report slma002h suggests 0.33 mm diameter via, which suggestion is better?

    Either would be fine, see info from App Note below. The 0.33mm via should offer higher current capacity and be able to transfer more heat.

    Luke Chen said:
    On the back of PowerPAD, what method is recommended to get better heat dissipation? Is there any risk if customer uses bare copper like the front of PowerPAD?

    Do you mean for the backside of the PCB (i.e. side the C2000 is not soldered onto)? I don't see any specific guidance on this in the datasheet or App Note. I suppose you could put some external heat-sink on the backside if deemed necessary.

    Best,

    Kevin

  • 0 in reply to Kevin Allen18
    TI__Expert 5090 points

    Kevin,

    Yes, I meant for the backside of the PCB. As you mentioned, we don't have any specific guidance on this.

    Do you see any concern if customer uses bare copper on the backside of PowerPAD area?

    Regards,

    Luke

  • +1 in reply to Luke Chen
    TI__Mastermind 45236 points

    Hi Luke,

    It's OK to do and a heatsink could be soldered onto the back even. Only concern is something could touch and short to the exposed copper on the back side of the board, but this may not be a concern in some designs.

    Best,

    Kevin