TMS320F28377D: Solder joint voids

Ivy Jin

Intellectual 2345 points

Part Number: TMS320F28377D

Hi team,

For the solder joint voids of F28377D, do you have some recommendation or criteria?

Thanks.

Regards,

Ivy

over 1 year ago

0 MatthewPate over 1 year ago

TI__Guru 71785 points

Ivy,

Can you comment on which package is being used in this case, either the TQFP or the BGA? Have the voids been visually verified, or are you suspecting voids based on some electrical behavior of the device?

Best,
Matthew

0 Ivy Jin over 1 year ago in reply to MatthewPate

TI__Intellectual 2345 points

Hi Matthew,

The package is HLQFP(PTP) 176pin.

My customer would like to know what the risk is if the solder joint voids ratio more than 50%.

Regards,

Ivy

+1 MatthewPate over 1 year ago in reply to Ivy Jin

TI__Guru 71785 points

Ivy,

Take a look at this post, regarding number of voids that are allowed https://e2e.ti.com/support/microcontrollers/c2000-microcontrollers-group/c2000/f/c2000-microcontrollers-forum/957776/tms320f28377s-solder-void-information-for-thermal-pad-hlqfp-package/3539567#3539567

Best,

Matthew

C2000™︎ microcontrollers

C2000 microcontrollers forum

TMS320F28377D: Solder joint voids