Dear TI team,
We have a project with the following requirements:
- The parts used shall withstand at least 200 ºC.
- The parts shall comply with RoHS.
- The microcontroller shall be of the family SM320F28335-HT.
The P/N SM320F28335GBS withstands 210 ºC, but it is non RoHS compliant. Our current approach is to obtain SM320F28335KGDS1 die and subcontract a specialized company to encapsulate it and guarantee that it complies with the 200 ºC and RoHS requirements.
I have some doubts about SM320F28335-HT family of devices.
SM320F28335GBS:
- We have revised the SM320F28335-HT datasheet with an expert in die packaging and some doubts have arised respect to RoHS.
- Page 179, notes F. If we select gold-plated pins instead of solder-dipped pins, could the device be RoHS compliant?
- Page 179, notes E. If we use ceramic lids instead of metal lids, could the device be RoHS compliant?
- Maybe page 176, note 6 is valuable respect to the above options.
- Our expert says that the unique location where he thinks that lead would be used is in the pins, and with the gold-plated option this issue would be removed.
- Is there another location where non-compliant RoHS substances are present?
SM320F28335KGDS1:
- I can't find the drawings of the die version. In the datasheet I have only found the drawings for the ceramic and HLQFP versions.
- Is this information publicly available?
- We are contacting with third parties to encapsulate the die. What information should we provide them about the die? Could you please provide it to me?
Regards,
Juan Manuel.