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TMS320F28P650SH: Question about PCB copper pouring

Julia Li
Expert 4415 points
Part Number: TMS320F28P650SH

Hi Champs,

Customer now is designing the schematic diagram and PCB. They found that there were many via holes at the bottom of the 176pin package. Customer want to know whether all four layers of copper must be laid at the bottom of the DSP? Or can the board's surface layer of DSP part not be laid with copper? Because customer are worried that if the surface layer is also covered with copper, there will be overflowing solder connected to the pins.
Do we have any requirements for the copper laying of circuit boards? Customer wants to know if there is no copper on the surface under the DSP. Thanks!

Best Regards,

Julia

  • 0
    TI__Expert 4415 points

    Hi champs,

    Not sure what goes wrong, I can't edit the above post, customer want to know if the surface under the DSP need to be copper poured, in HLQFP176 package. Our demo board only use BGA package. Thanks!

  • 0 in reply to Julia Li
    TI__Mastermind 37900 points

    Hi Julia,

    The PTP176 package is a PowerPAD type, meaning that the bottom metal layer of the package has to thermally conduct to the copper and vias defined by the area bound by the green square (6.237x6.237) at a minimum to ensure proper thermal conductivity of the device when running at speed and maximum loads.  This is no different from the 176P F2837x and F2838x PowerPAD devices.

    Regards,

    Joseph