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TMS320F28P650DH: Use VREG(internel LDO) have high temperature than external LDO

Zane Wei
Intellectual 1735 points
Part Number: TMS320F28P650DH


 Hi Team,

Use VREG(internel LDO)(60℃) have high temperature than external LDO（40℃）

Will it improve with a different package? Such as use QFN to QFP?

 

Thanks a lot!

Best Regards,

Zane

  • 0
    TI__Guru* 80600 points

    Zane,

    Keep in mind that the VREG disabled graph is measuring the VDD rail(IDD), while the VREG enable graph is measuring the VDDIO rail(IDDIO), so the power consumption will be significantly different for these two conditions.  In case of VREG enabled that current will be dropped across the 3.3V rail, vs case where VREG is disabled will drop across only the 1.2V supply.

    These graphs are wrt junction temperature, so this is independent of package.  Now, the goal in the system should be to keep the junction temperature at or below 150C based on the power consumed and external free air temperature.  You can compare the different packages thermal transfer characteristics in the DS here: https://www.ti.com/document-viewer/TMS320F28P650DH/datasheet#GUID-5A720478-9E31-4F51-931D-768A6EB956E6/GUID-9240F1DC-E273-4C68-B7B8-1E41ECCAACFE

    You will see that while the BGA packages have slightly better thermal transfer parameters, the TQFPs are not much different, due to use of power pad underneath the device to assist with heat transfer.

    Feel free to let me know if you have other questions.

    Best,

    Matthew