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F28066PFP data sheet and packaging question

Todd Solak
Intellectual 1415 points


Hello,

I have a question – concerning the thermal pad of the PFP/PZP packages of the TMS320F28066PFP?  Is there any electrical connection recommendation?  Should it be left “floating” or be connected to GND?

 

Also, there appears to be an error in the 2806x datasheet, in the product selection table (section 3.1).  For “High Resolution Capture Modules (HRCAP)” it lists “4” for all parts, all packages.  Actually, it looks like there is only ONE HRCAP available in the 80pin packages.  Is thsi true?

Thanks,

Todd

 

  • 0
    TI__Intellectual 1050 points

    Todd,

    It is up to the customer how they want to connect the thermal pad. Generally, connecting it to ground is ok since the pad is not connected to ground on the die. It really depends on their application, their board, and the amount of heat dissipation they require.

    That is indeed a mistake. Thank you for pointing this out, we do need to update the datasheet so that the 80-pin package config chart correctly shows 1 HRCAP.

    -Michael