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TMS320F28075: TMS320F28075PZPT Layout Question

AndreTseng
Intellectual 2745 points

Part Number: TMS320F28075

Tool/software:

Hi expert,

     My customer applied the MCU’s (TMS320F28075PZPT) symbol and have a question regarding the land pattern. As shown in the attached screenshot, within the dashed area labeled "Metal covered by solder mask," should the vias be treated with via filling, or is it sufficient to cover them with solder mask over the area on the PCB?

Thanks for your help

Andre

  • +1
    TI__Expert 6020 points

    Hi Andre,

    are you asking about the type of vias to be preferred then through hole should be enough, since its QFP package. 

    Buried/filled vias add costs to the PCB and only used if you board is very small and no trace routing available.

    Best Regards,

    Uttam