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Original question:

TMS320F28377D: Require support on Material Finish and soldering process

TMS320F28377D: Controller reflow temperature profile and assembly options

Sourav Garnaik
Prodigy 40 points
Part Number: TMS320F28377D


Tool/software:

Based on the below picture, the reflow temperature is mentioned 220°C for the component which we are using in our design. We are going for a lead-free assembly process. 

1. If the re-balling is done to this component with lead-free balls and process a lead-free assembly, can this device withstand a temperature of 260°C and process for lead free assembly. 

2. As per note 6, do you produce this component with lead free balls? If yes, what is the part number and ordering process for it.

  • 0
    TI__Guru* 81500 points

    Sourav,

    I can't guarantee any operation that is outside the existing TI DS limits including reflow temp here.  For this extended performance device, we only offer this in leaded balls based on market need, namely military/avionics traditionally requires leaded balls for BGA.

    Best,

    Matthew